Msl Level 3 Shelf Life

When the moisture sensitive bag is opened the flo life will start.

Msl level 3 shelf life.

For an unopened bag packaged in a sealed mbb with desiccant the shelf life of smd is greater than 5 years for msl 3 parts and unlimited for msl 1 and msl 2. For connector products stored at harwin at the end of the 3 year shelf life any components that have not been sold are destroyed and responsibly recycled. Upon opening of mbb the end customer should check the hic immediately. The end customer should be advised of the shelf life of modules in a sealed bag.

Msl 1 2 3 rating and peak reflow labeling examples on cardboard box 2 applying the moisture sensitivity level msl the msl rating of an ic determines its floor life before board mounting after the drypack packing msl2. The msl is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions 30 c 85 rh at level 1. Moisture sensitivity level relates to the packaging and handling precautions for some semiconductors. 30 c 60 rh at all other levels.

All allegro packages whether smd or not have a minimum shelf life of 5 years. Management of moisture sensitive devices begins with understanding each devices level of sensitivity. If you have any questions regarding this statement. The classification of moisture sensitive components is outlined in the ipc specification j std 20.

Increasingly semiconductors have been manufactured in smaller sizes. Moisture caution label msl 3 3 caution this bag contains moisture sensitive devices 1. 36 months at 40 c and 90 relative humidity rh 2.

The permissible time from opening the moisture barrier bag until the final soldering process that a component can remain outside the moisture barrier bag is a measure of. In case thedevice is qualified according to fujitsu msl level the conditions are listed in. It is recommended that shelf life should not exceed 12 months at 40ºc and 90 rh. 2 3 floor life and msl level.

Shelf life in sealed bag. Modules are rated msl 3. Below is a basic chart which defines moisture exposures applicable to surface mount device smd packages. Moisture sensitivity level msl.

After this bag is opened devices that will be subjected to convection reflow or equivalent processing peak package body temperature of 220 c must be.